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HYG1233A01001A

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HYG1233A01001A
Production process

Specification
Code HYG1233A01001A Customer PN


Layer 1 Blind/Buried Via NO

Base Material Alu
Unit Size(mm) 566.0000 X 6.3000
Board thickness 0.8mm Panle Size(mm) 566.0000 X 240.5000
Min hole / Pcs/Panle 1 X 35
Total Holes / Copper OZ(finish) 1OZ Base Cu /
W/S(mil) /
Min Hole Copper Thickness /

Outline Finish CNC+V-CUT
Finish thickness tolerance +/-10%

Contour tolerance +/-0.15mm Surface Finishing
OSP

X-out 3X Solder Mask White

Special request Ink thickness is not less than 10um, process edge and UL mark, cycle Silkscreen Black

ISO Certification

UL Certification

Application areas

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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