HYG896F01003A


flex pcb



Production process:


Cutting1.jpgChemical&Physical Laborato.jpgInner Dry Film Imaging.jpgInner layer etch.jpg
Cutting
laboratoryDry FilmInner Etching
Auto Drill Bit Sharpener.jpgDrilling (Auto Drilling machine).jpgPTH & Surface Copper Measu.jpgPanel plating.jpg
Auto Drill Bit SharpenerDrillingPTHPanel Plating
HASL Line (Lead and Lead.jpgENIG ThicknessSolder Mask.jpgAuto E-test Machine.jpg
HASL Lead FreeImmersion Gold
Solder MaskE-test
Routing.jpgFQC.jpgAOI Test.jpgInspection Machine.jpg
ProfileFQCAOI SacningInpection Machine
Final Audi.jpgpacking.jpg


Final AudiPacking

 Specification:

CodeHYG896F01003ACustomer PNCP-1706/15100/010MO/751

Layer1Blind/Buried ViaNO

Base MaterialPIUnit Size(mm)320.0000
X230.0000
Board thickness0.12mmPanle Size(mm)/
X/
Min hole/Pcs/Panle1X1
Total Holes/Copper OZ(finish)/Base CuHOZ
W/S(mil)11.8Min Hole Copper Thickness/

Outline FinishCNC
Finish thickness tolerance+/-10%

Contour tolerance+/-0.1mmSurface Finishing
HASL Lead Free


X-out/Solder Mask/

Special request
Silkscreen/

Customer Evaluation:



20170809113338_62641_副本_副本.jpg20170809115057_80100_副本.jpgone.jpg20170809115226_98108_副本.jpg


Certification:



Contact us:

Welcome to the HOYOGO website!

HONGKONG HOYOGO ENTERPRISES CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.

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