1 Layer FR4 0.13 8up ENIG

1 layer pcb


   Base Material:FR4

   Board Thickness:0.13mm

   Unit size:250x135mm

   Up number:8up      

Surface Finishing:

   Solder Mask:ENIG (Au 1U)  

   Copper OZ:1OZ

HOYOGO Advantages:

----Special price support for 2~8layer mass production, especially for Automotive parts.

----Effective production lead time: 2weeks for double-sided, 3 weeks for multi-layer conventional PCB.

----Professional Technical support for Flex, rigid-flex and HDI boards.

----Quick turn-around service in 3~7days.

----Quick action: fast in 1 hour, standard in 24 hours.

----Flexible and professional logistical team to win time and costs during transportation.

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Flexible circuit board features

  • Reduce the volume of application products, save space, significantly reduce the weight, increase the role, reduce costs.

  • With a high degree of flexibility, three-dimensional wiring, change the shape according to space constraints.

  • Can fold without affecting the signal transmission function, anti-static interference.

  • Resistant to high and low temperature, flame resistant.

  • Chemical changes are stable, stable and reliable.

  • Provide more related solutions for related products, reduce assembly time and errors, and increase the life of related products

Application area

Flexible circuit boards are widely used in commercial electronic devices, automotive dashboards, printers, hard drives, floppy drives, fax machines, mobile phones for automobiles, general phones, notebook computers, cameras, video cameras, CD-ROMs, Hard disks, watches, computers, cameras, medical equipment and other electronic products and devices


Special request

Features: FPC must have MARK mark for substrate positioning, FPC itself should be flat. FPC is difficult to fix, consistency is difficult to guarantee when mass production, high equipment requirements. In addition, the control of printing paste and placement process is more difficult.

The key process: 1.FPC soft board fixing: It is fixed on the pallet from the printing patch to reflow soldering. The pallet used requires low thermal expansion coefficient.

The placement accuracy is more than 0.65mm for the QFP lead spacing: The pallet is placed on the positioning template. The FPC is fixed on the pallet with a thin high-temperature tape, and then the pallet is separated from the positioning template for printing. The high temperature adhesive tape should have a moderate viscosity. After reflow soldering must be easy to peel, and there is no residual glue on the FPC.

The placement accuracy is less than 0.65mm for QFP lead spacing: The pallets are customized, and their process requirements must be minimally deformed after multiple thermal shocks. There is a T-shaped positioning pin on the pallet. The height of the pin is slightly higher than that of the FPC.

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