HYG802F02013A


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Production process:


Cutting1.jpgChemical&Physical Laborato.jpgInner Dry Film Imaging.jpgInner layer etch.jpg
Cutting
laboratoryDry FilmInner Etching
Auto Drill Bit Sharpener.jpgDrilling (Auto Drilling machine).jpgPTH & Surface Copper Measu.jpgPanel plating.jpg
Auto Drill Bit SharpenerDrillingPTHPanel Plating
HASL Line (Lead and Lead.jpgENIG ThicknessSolder Mask.jpgAuto E-test Machine.jpg
HASL Lead FreeImmersion Gold
Solder MaskE-test
Routing.jpgFQC.jpgAOI Test.jpgInspection Machine.jpg
ProfileFQCAOI SacningInpection Machine
Final Audi.jpgpacking.jpg


Final AudiPacking

 Specification:

CodeHYG802F02013ACustomer PN


Layer2Blind/Buried ViaNO

Base MaterialPIUnit Size(mm)59.9300
X35.0700
Board thickness0.26mmPanle Size(mm)180.0000X118.0000
Min hole0.7mm
Pcs/Panle2X4
Total Holes24Copper OZ(finish)1OZBase Cu/
W/S(mil)9.8/8Min Hole Copper Thickness/

Outline FinishCNCFinish thickness tolerance+/-0.05mm

Contour tolerance+/-0.13mmSurface Finishing
ENIG Thickness

X-out/Solder Mask/

Special requestFlex,Yellow coverSilkscreen/


Customer Evaluation:

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Certification:



Contact us:

Welcome to the HOYOGO website!

HONGKONG HOYOGO ENTERPRISES CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.

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Keywords:Flex&Rigid PCB|flex pcb|flexible printed circuit|flexible