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HYG802F02013A

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HYG802F02013A
HYG802F02013A
Production process

Specification
Code HYG802F02013A Customer PN


Layer 2 Blind/Buried Via NO

Base Material PI Unit Size(mm) 59.9300
X 35.0700
Board thickness 0.26mm Panle Size(mm) 180.0000 X 118.0000
Min hole 0.7mm
Pcs/Panle 2 X 4
Total Holes 24 Copper OZ(finish) 1OZ Base Cu /
W/S(mil) 9.8/8 Min Hole Copper Thickness /

Outline Finish CNC Finish thickness tolerance +/-0.05mm

Contour tolerance +/-0.13mm Surface Finishing
ENIG Thickness

X-out / Solder Mask /

Special request Flex,Yellow cover Silkscreen /
Customer Evaluation
20170809113338_62641_副本_副本.jpg 20170809115057_80100_副本.jpg one.jpg 20170809115226_98108_副本.jpg

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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