4L Flex rigid board 1.82mm FR4 PI

2994.jpg


    Layer:4

   Base Material:FR4+PI

   Board Thickness:1.82mm

   Unit size:300.37 x 80.16mm

   W/S(mil):4u

Surface Finishing: ENIG Thickness

   Solder Mask:Green 

   Copper OZ:1OZ



Production Leadtime.png


Layer

Quick service

Standard service

Double-sided

3days

10days

4Layer

5days

12days

6Layer

6days

14days

8Layer

7days

15days

10Layer

8days

18days

10Layer above

8-10days

20days



Automotive board.jpgHYG002R06004A(1)_副本.jpgIMG_6527.jpg
Rigid-flex4 .pngIMG_5501.JPGpcb.jpg



capability.png

Item

Flex pcb

Rigid-Flex pcb

Material

PI,PET,PEN

FR4+PI

Layers

1-12

2-12

Base copper thickness

1/4-2OZ

1/4-2OZ for flex,1/4-4oz for rigid

Board dimension(Max)

500mm x 800mm

Via type

Through hole, blind , buried

Silkscreen Width/Space

0.10mm

Solder mask bridge

0.20mm for coverlay ,0.12mm for LPI

Drill

0.15mm

Punching

0.5mm

Ni/Auplating

Ni:2-8um(80-320u) Au:0.05-2um(2-80)

ENIG

Ni:2-6um(80-240u) Au:0.05-0.10um(2-4u)

Tin plating

5-20um

Immersion silver

0.1-0.4um

Immersion Tin

0.5-1.5um

OSP

0.2um min

Hard gold

Hardness over 150HV


Special Techniques--Blind & Buried via, via in pad ,hard gold and gold fingers,Flash gold,Ni/Pd/Au finish,Edge plating.Depth control routing,Countersunk holes,etc


Special Services--FPC & Rigid/Flex quick turn, heavy copper mass production, IMS boards
PCBA Assembly Service--Small Volume and mass production


FPC.png


Characteristics of the flexible board: FPC is widely used in the occasions where dynamic structure is needed, and its bending resistance and pull resistance are its greatest characteristics!

Bend factors:

N1. Copper structure: The rolled copper has better tensile properties than ED copper. In the occasions where bending and pulling are required, it is generally necessary to use rolled copper!

N2. Minimum Tension Fatigue: In order to obtain the minimum tensile fatigue of the copper in the circuit, the press-fit structure of the FPC needs to be balanced!

N3. Bending radius: If the bending radius is large, the tension at the stress point can be reduced, and the bending life can be increased!

N4.FPC thickness: FPC thickness can reduce the stress of the copper wire



Rigid-flex5.jpg528R01192A.....jpg



other factors:

1. Surface, smooth edge, pressure point

2. The stress point

3. The thickness of the glue, over-squeezing, and lack of glue all cause imbalance

4. Layering, poor structure may lead to rapid destruction of the line

5. Markable, PI edge is not smooth can cause tearing

6. Improper operation, copper wrinkles

7. improper STF structure, affect the bending area

8. Copper surface treatment will lead to structural imbalance



4L <a href='/' class='keys' title='点击查看关于PCB的相关信息' target='_blank'>PCB</a>.jpgFlex rigid board.jpg




HYG Advertising slogan.png




Keywords:Flex rigid pcb | FPC | pcb manufacturer