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Products

HYG002AF01003A

Product Image
HYG002AF01003A
Production process

Specification
Code HYG002AF01003A Customer PN


Layer 1 Blind/Buried Via NO

Base Material FR4+Alu 
Unit Size(mm) 75.0000 X 193.0000
Board thickness 1.73mm Panle Size(mm) /
X /
Min hole 0.45mm Pcs/Panle 1 X 1
Total Holes / Copper OZ(finish) 1OZ Base Cu /
W/S(mil) /
Min Hole Copper Thickness 20um

Outline Finish CNC
Finish thickness tolerance +/-10%

Contour tolerance +0.15mm Surface Finishing
ENIG Thickness2u"

X-out
Solder Mask Green

Special request
Silkscreen White

ISO Certification

UL Certification

Application areas

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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