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HYG089R02273A

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HYG089R02273A
Product Details

Layer: 2L

Base Material: FR4 TG130

Board Thickness: 1.6mm

Final Copper Thickness: 1OZ

Surface Finished: ENIG

Unit Size(mm): 216.0*74.0

Panel Size(mm): 216.0*238.0

Solder Mask: White

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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