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HYG1233A01003A

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HYG1233A01003A
HYG1233A01003A
Production process

Specification
Code HYG1233A01003A Customer PN


Layer 1 Blind/Buried Via NO

Base Material Alu CTI600 2W
Unit Size(mm) 1400.0000 X 40.0000
Board thickness 1.5mm Panle Size(mm) 1400.0000 X 160.0000
Min hole 4.2 Pcs/Panle 1 X 4
Total Holes 10PCS Copper OZ(finish) 1OZ Base Cu /
W/S(mil) 39.4/11.7 Min Hole Copper Thickness /

Outline Finish CNC
Finish thickness tolerance /

Contour tolerance +/-0.15mm Surface Finishing
OSP

X-out / Solder Mask White

Special request Add tag Silkscreen Black

ISO Certification

UL Certification

Application areas

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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