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Products

HYG306RF04031A

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HYG306RF04031A
Product Details

Layer: 4L

Base Material: FR4 TG150+PI

Rigid PCB Thickness: 1.6mm | Rigid PCB: 3-4Layer

Flex PCB + PI Stiffener Thickness: 0.3±0.05mm | Flex PCB: 1-2Layer

Final Copper Thickness: 1OZ

Surface Finished: ENIG

Unit Size(mm): 322.0*27.58

Panel Size(mm): 342.0*148.3

Min W/S(mil): 10.5/7.5

Min Hole Size: 0.2mm

Production process

ISO Certification

UL Certification

Application areas

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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