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HYG804R02009A

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HYG804R02009A
Product Details

Layer : 2L

Base Material : FR4 ITEQ IT158TC

Board Thickness : 1.6mm

Final Copper Thickness : 1OZ

Surface Finished : HASL Lead

Unit Size(mm) : 17.02*128.78

Panel Size(mm) : 277.88*428.75

Min Hole Copper Thickness : 20um

special request : No line-supplyment

Min. Tin thickness: 2um

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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