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HYG882R06019A

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HYG882R06019A
Product Details

Layer: 6L

Base Material: FR4

Board Thickness: 1.65mm

Final Copper Thickness: 1OZ

Surface Finished: ENIG+Immersion Silver

Panel Size(mm): 210.82*154.94

Min W/S(mil): 5/5

Min Hole Size: 0.23mm

Solder Mask: Blue

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ISO Certification

UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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