HYG882R12023A | Impedance Control+BGA

Product Image

Product Details

Layer : 12L

Base Material : FR4

Board Thickness : 1.8mm

Final Copper Thickness : 1OZ

Surface Finished : ENIG

Unit Size(mm) : 50.8*50.8

Panel Size(mm) : 114.3*167.64

Min W/S(mil) : 5/5

Min Hole Size : 0.2mm

Solder Mask : Blue

Special Request : Impedance Control+BGA

Production process

ISO Certification

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.