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Peelable mask+high temperature adhesive

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Peelable mask+high temperature adhesive
Peelable mask+high temperature adhesive
Peelable mask+high temperature adhesive
Product Details

Layer : 2L

Base Material : FR4 TG130

Board Thickness : 2.4mm

Final Copper Thickness : 35um

Surface Finished: HASL Lead Free

Unit Size(mm) : 200.4*222.02

Panel Size(mm) : 200.4*222.02

Min W/S(mil) : 10/6.2

Peelable mask+high temperature adhesive

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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