Application Area: Medical Layer: 6L Base Material: FR4 TG135 Board Thickness: 1.6mm Final Copper Thickness: 1OZ Surface Finished: ENIG+Gold Finger Unit Size(mm): 447.8*30.0 Panel Size(mm): 447.0*150.0 Min W/S(mil): 8/7 Min Hole Size: 0.2mm
https://www.hoyogo.com/Medical-PCB.htmlSpecial Request: BGA Layer: 8L Base Material: FR4 Board Thickness: 1.68mm Final Copper Thickness: 1OZ Surface Finished: ENIG Unit Size(mm): 220.0*100.0 Panel Size(mm): 240.0*120.0 Min W/S(mil): 3.9/3.9 Min Hole Size: 0.15mm Solder Mask: Gre...
https://www.hoyogo.com/BGA-PCB.htmlSpecial Request: Impedance Control Layer: 4L Base Material: FR4 S1000-2 TG170 Board Thickness: 1.6mm Final Copper Thickness: 1OZ Surface Finished: ENIG Unit Size(mm): 156.6*224.0 Panel Size(mm): 180.0*234.0 Min W/S(mil): 5.2/6.3
https://www.hoyogo.com/Impedance-Control-PCB.htmlHigh density PCB Special Request: Blind buried via Layer: 6L Base Material: FR4 TG170 Board Thickness: 1.54mm Final Copper Thickness: 1OZ Surface Finished: ENIG Unit Size(mm): 90.0*50.0 Panel Size(mm): 195.0*102.0 Min W/S(mil): 3.4*5.37 Min...
https://www.hoyogo.com/High-Density-Interconnector-PCB.htmlHigh density PCB Special Request: Blind buried via Layer: 6L Base Material: FR4 TG170 Board Thickness: 1.54mm Final Copper Thickness: 1OZ Surface Finished: ENIG+Impedance control Unit Size(mm): 90.0*50.0 Panel Size(mm): 195.0*102.0 Min W/S(mil): ...
https://www.hoyogo.com/6L-High-Density-Interconnector-PCB.htmlCountersink Aluminum PCB Layer: 1L Base Material: ALU 2W/MK Board Thickness: 1.5mm Final Copper Thickness: 1OZ Surface Finished: HASL Lead Free Unit Size(mm): 134.0*34.5 Panel Size(mm): 345.0*288.0 Solder Mask: Taiya PSR
https://www.hoyogo.com/Countersink-Aluminum-PCB.htmlLayer: 2L Base Material: FR4 TUC TU768 Board Thickness: 1.0mm Final Copper Thickness: 1OZ Surface Finished: Immersion Tin+Edge Plating Unit Size(mm): 30.5*15.0 Panel Size(mm): 183.0*158.5 Solder Mask: Dark Green Solder Mask Thickness: min 10um
https://www.hoyogo.com/Immersion-Tin-PCB.htmlBlind buried vias PCB Layer: 6L Base Material: FR4 Board Thickness: 1.6mm Final Copper Thickness: 2OZ Surface Finished: ENIG Unit Size(mm): 25.6*16.0 Panel Size(mm): 187.0*268.0
https://www.hoyogo.com/Blind-buried-vias-PCB.htmlPeelable Mask( high temperature tape on the bottom) Layer: 8L Base Material: FR4 TG150 Board Thickness: 1.55mm Final Copper Thickness: 2OZ Surface Finished: ENIG Unit Size(mm): 180.0*194.0 Panel Size(mm): 204.0*194.0 Min W/S(mil): 7.8/7.8 Min Hol...
https://www.hoyogo.com/high-temperature-tape-PCB.htmlTin Finger PCB Layer: 2L Base Material: H140A Board Thickness: 1.0mm Final Copper Thickness: 1OZ Surface Finished: HASL Lead Free Unit Size(mm): 215.0*177.5 Min W/S(mil): 5.9/5.9 Min Hole Size: 0.2mm Solder Mask: Black
https://www.hoyogo.com/Tin-Finger-PCB.htmlLayer: 1L Base Material: ALU(Ventec VT4B3 3W/MK 100um dielectric) Board Thickness: 1.6mm Final Copper Thickness: 3OZ Surface Finished: HASL Lead Free Unit Size(mm): 18.8*74.8 Panel Size(mm): 206.0*179.6 Solder Mask: Blue
https://www.hoyogo.com/Blue-Aluminum-PCB.htmlRigid-Flex PCB Layer: 4L Base Material: FR4 TG135+PI Rigid Board Thickness: 0.43mm Flex Board Thickness: 0.15mm Surface Finished: ENIG Unit Size(mm): 146.0*10.8 Panel Size(mm): 106.0*91.0 Min W/S(mil): 9.8/8 Finger Area Thickness: 0.33±0.05mm
https://www.hoyogo.com/Rigid-Flex-PCB.htmlDepth Milling PCB Layer: 4L Base Material: FR4 TG150 Board Thickness: 1.6mm Final Copper Thickness: 1OZ Surface Finished: HASL Lead Free+Peelable Mask Unit Size(mm): 52.0*52.0 Panel Size(mm): 254.0*180.0 Min W/S(mil): 7/8 Min Hole Size: 0.2mm&nbs...
https://www.hoyogo.com/Depth-Milling-PCB.htmlLED Aluminum PCB Layer: 1L Base Material: ALU 1W/MK Board Thickness: 1.6mm Final Copper Thickness: 1OZ Surface Finished: HASL Lead Free Unit Size(mm): 66.0*62.0 Panel Size(mm): 264.0*142.0 Solder Mask: White Solder Mask for LED
https://www.hoyogo.com/LED-Aluminum-PCB.htmlThick PCB Layer: 8L Base Material: KB-6165F Board Thickness: 3.54mm Outer Copper Thickness: Min. 52.9um Inner Copper Thickness: 189um Surface Finished: ENIG Unit Size(mm): 454.0*257.0 Solder Mask: Green Matt Special Request: Line angle minimum 5.08um, line area maximum 50.8um
https://www.hoyogo.com/Thick-PCB.htmlImpedance Control PCB Layer: 6L Base Material: FR4 TG150 Board Thickness: 0.8mm Final Copper Thickness: 1OZ Surface Finished: ENIG+Impedance Control Unit Size(mm): 75.0*75.0 Panel Size(mm): 176.0*245.0 Min W/S(mil): 4/4 Min Hole Size: 0.2mm Special Request: BGA
https://www.hoyogo.com/6-Layer-Impedance-Control-PCB.htmlLayer: 6L Base Material: FR4 TG135 Board Thickness: 0.787mm Final Copper Thickness: 1OZ Surface Finished: ENIG Unit Size(mm): 12.7*66.04 Panel Size(mm): 96.52*86.36 Min W/S(mil): 6/5 Min Hole Size: 0.15mm Special Request: BGA
https://www.hoyogo.com/6-Layer-BGA-PCB.htmlRigid-Flex PCB Layer: 4L Base Material: FR4 TG180+PI Rigid Board Thickness: 1.0±0.1mm Flex Board Thickness: 0.18±0.03mm | GTL-L2 Layer Surface Finished: ENIG Unit Size(mm): 61.7*45.4 Panel Size(mm): 81.7*120.0 Min W/S(mil): 5.9/5.9 Min Hole Size: 0.2mm Solder Mask: Green+Yellow
https://www.hoyogo.com/4-Layer-Rigid-Flex-PCB.htmlLayer: 6L Base Material: FR4 TG171 Board Thickness: 1.54mm Final Copper Thickness: 1OZ Surface Finished: ENIG+Impedance Control Unit Size(mm): 90.0*50.0 Panel Size(mm): 195.0*102.0 Min W/S(mil): 3.4/5.37 Min Hole Size: 0.15mm L1-L3, L3-L4, L4-L6 have blind and buried vias
https://www.hoyogo.com/blind-and-buried-vias-PCB.htmlCarbon Ink PCB Layer: 2L Base Material: FR4 TG135 Board Thickness: 1.55mm Final Copper Thickness: 1OZ Surface Finished: HASL Lead Free+Carbon Ink Unit Size(mm): 405.9*250.0 Panel Size(mm): 415.9*260.0 Min W/S(mil): 3.94/3.94
https://www.hoyogo.com/Carbon-Ink-PCB.htmlLayer: 14L Base Material: FR4 TG170 Board Thickness: 2.0mm Final Copper Thickness: 1OZ Surface Finished: ENIG+Impedance Control Unit Size(mm): 285.0*100.0 Panel Size(mm): 305.0*120.0 Min W/S(mil): 3/3 Min Hole Size: 0.2mm
https://www.hoyogo.com/14L-PCB.htmlLayer: 14L Base Material: FR4 Isola FR408-HR Board Thickness: 2.13mm Final Copper Thickness: 1OZ Surface Finished: ENIG+Impedance Control Unit Size(mm): 140.0*127.0 Panel Size(mm): 165.4*152.4 Min W/S(mil): 3.8/4.0 Min Hole Size: 0.2mm Solder Mask: PSR-4000 Solder Mask Thickness: 10-50um Special Req...
https://www.hoyogo.com/14L-Impedance-Control-PCB.htmlLayer: 2L Base Material: FR4 Board Thickness: 1.6mm Final Copper Thickness: Min. 83.7um Surface Finished: OSP Unit Size(mm): 1540.0*30 Panel Size(mm): 1540.0*200.0 Solder Mask: Taiya PSR4000 WT-02 Special Request: Bow&Twist: ≤0.75%
https://www.hoyogo.com/Super-Long-PCB.htmlFR4 Stiffener FPC Layer: 2L Base Material: PI+FR4 Stiffener Board Thickness: 0.18mm Final Copper Thickness: 25um Surface Finished: ENIG Unit Size(mm): 57.85*36.75 Panel Size(mm): 137.0*206.0 Solder Mask: Green+Yellow
https://www.hoyogo.com/FR4-Stiffener-Flex-PCB.htmlLayer: 8L Base Material: FR4 TG150 Board Thickness: 1.6mm Final Copper Thickness: 1OZ Surface Finished: ENIG+Impedance Control Unit Size(mm): 36.57*51.88 Panel Size(mm): 192.86*207.53 Min W/S(mil): 3.5/4.0 Min Hole Size: 0.2mm Solder Mask: Blue Special Request: BGA
https://www.hoyogo.com/Impedance-Control-BGA-PCB.htmlThere are half holes in 3 sides of the unit Layer: 4L Base Material: FR4 TG170 Board Thickness: 0.8mm Final Copper Thickness: 1OZ Surface Finished: ENIG Unit Size(mm): 22.0*18.0 Panel Size(mm): 138.0*98.0 Min Hole Size: 0.2mm Special Request: BGA
https://www.hoyogo.com/half-hole-PCB.htmlAutomotive PCB Project Layer: 2L Base Material: FR4 TG150 Board Thickness: 1.6mm Final Copper Thickness: 1OZ Surface Finished: HASL Lead Free Unit Size(mm): 25.2*31.08 Panel Size(mm): 278.0*165.2 Solder Mask: Green Matt
https://www.hoyogo.com/Automotive-PCB-Project.htmlCeramic PCB Layer: 1L Base Material: AIN Fujian Huaqing, thermal conductivity min. 170W/MK Board Thickness: 1.17mm Final Copper Thickness: min 55.7um Surface Finished: ENIG Unit Size(mm): 78.0*78.0 Panel Size(mm): 78.0*78.0 Solder Mask: Taiyo RSP4000 WT02
https://www.hoyogo.com/Ceramic-PCB.htmlMultilayer Thick Copper PCB Layer: 6L Base Material: FR4 Board Thickness: 3.6±0.3mm Final Copper Thickness: 105UM Surface Finished: ENIG Panel Size(mm): 330*520
https://www.hoyogo.com/Multilayer-Thick-Copper-PCB.htmlBlind Via PCB Layer: 4L Base Material: FR4 Board Thickness: 0.8mm Final Copper Thickness: 1OZ Surface Finished: ENIG Unit Size(mm): 41.797*78.81 Panel Size(mm): 170.789*85.81 Min W/S(mil): 7/7 Min Hole Size: 0.2mm
https://www.hoyogo.com/Blind-Via-PCB.htmlLayer: 6L Base Material: FR4 TG150 Board Thickness: 1.0mm Final Copper Thickness: 1OZ Surface Finished: ENIG+Immersion Tin Unit Size(mm): 30.0*50.95 Panel Size(mm): 231.5*182.5 Min W/S(mil): 5.9/5.9 Min Hole Size: 0.2mm Solder Mask: Green Matt
https://www.hoyogo.com/Immersion-Tin.htmlSun PCB, Smile PCB Layer: 6L Base Material: FR4 Board Thickness: 0.8mm Final Copper Thickness: 1OZ Surface Finished: ENIG Unit Size(mm): 54.0*93.0 Panel Size(mm): 282.0*230.0 Min W/S(mil): 5/5 Min Hole Size: 0.1mm Solder Mask: Black Glossy The top silkscreen are printed in black --> white --> ...
https://www.hoyogo.com/Sun-Smile-PCB.htmlLayer: 3L Base Material: FR4 TG150+PI Board Thickness: 1.0mm Surface Finished: ENIG+Impedance Control Unit Size(mm): 76.53*22.77 Min W/S(mil): 3.94/5.3 Min Hole Size: 0.1mm Solder Mask: Green+Yellow Coverlay
https://www.hoyogo.com/3-Layer-Rigid-flex-PCB.htmlThin PCB Special Request: Solder Mask Ink Model: PM-500 WD-87SF, Solder Mask Thickness on Copper Edge: Min. 10um. Layer: 2L Base Material: FR4 TG170 Board Thickness: 0.3mm Final Copper Thickness: 18um Surface Finished: ENIG Unit Size(mm): 239.50*21.00 Min W/S(mil): 10/11.6 Min Hole Size: 0.2m...
https://www.hoyogo.com/Thin-PCB.htmlSpecial Request: 1. Mixed FR4 and Alu together for pressing; 2. Printed the solder mask twice on TOP side; 3. A panel includes 2 different kinds of PCB. Layer: 2L Base Material: FR4+Alu(Thermal Conductivity: 2W/m·k) Board Thickness: 1.80mm Final Copper Thickness: 1OZ Surface Finished: ENIG Un...
https://www.hoyogo.com/Hybrid-PCBFR4ALU-HYG708R02001A.htmlSpecial Request: 1. Gold Finger(Alu: Min. 0.8um, Ni: Min. 2.5um) 2. Beveling Layer: 2L Base Material: FR4 TG170 Board Thickness: 1.6mm Final Copper Thickness: 2OZ Surface Finished: ENIG+Gold finger Unit Size(mm): 36.40*39.20
https://www.hoyogo.com/Gold-Finger-PCB-HYG1027R02002A.htmlLayer: 6L Base Material: FR4 TG170 Board Thickness: 1.6mm Final Copper Thickness: 1OZ Surface Finished: ENIG+Gold Finger+Impedance Control Unit Size(mm): 46.5*52.7 Panel Size(mm): 108.4*76.0 Min W/S(mil): 5/5.9 Min Hole Size: 0.2mm Solder Mask: Purple
https://www.hoyogo.com/Purple-Solder-Mask-PCB.html