Layer : 2L with NPTH ; Base Material : CEM3(R-1787) CTI≥600 ; Board Thickness : 1mm ; Final Copper Thickness : 1OZ ; Surface Finished : OSP ; Unit Size(mm) : 157.99*157.99 ; Panel Size(mm) : 170.43*508.0 ; Min W/S(mil) : 16/10 ; Solder Mask : White ; Special Process : Plate Bending&Twist 0.7% ; Sold...
https://www.hoyogo.com/Products/HYG528R02386A.htmlLayer:4 ; Base Material:FR4+PI ; Board Thickness:1.82mm ; Unit size:300.37 x 80.16mm ; W/...
https://www.hoyogo.com/Products/4LFlexrigidboard.htmlLayer: 2L ; Base Material: FR4 ; Board Thickness : 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 25.4*30.36 ; Panel Size(mm): 117.6*129.43 ; Min Hole Size: 0.25mm ;
https://www.hoyogo.com/Products/HYG089R04023B.html