3-step HDI PCB | HYG603R12007A

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Product Details

Special Request:
1. 3-step HDI PCB.
2. The blind vias are located between layers L1-12, L2-L3,
L3-L4, L9-L10, L10-L11, and L11-L12, as well as L9-L12.
They are laser-drilled and require copper filling and capping.
3. 18 groups of Impedance Control.
4. BGA PAD: 0.25mm.

Layer: 12L
Base Material: FR4 TG≥170℃
Board Thickness: 1.5mm
Outer Layer Final Copper Thickness: 30um
Inner Layer Final Copper Thickness: 1/3OZ+plating
Surface Finished: ENIG
Unit Size(mm): 191.00*123.00
Min. W/S(mil): 1.8/2.9
Min. Hole Size: 0.125mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s kind of PCB can you produce?
Our production is producing rigid PCB from 2~56layer with small- medium- mass volume. In the meantime, we can offer you FPC, Rigid-flex, HDI, all other special PCBs from our partner production.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com