Civil Aviation PCB | HYG1005R12012A

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Product Details

Special Request:
1. Civil Aviation PCB;
2. Specified Base Material: S1170G (Halogen Free),
Solder Mask Ink Model: Taiyo PSR-4000 GEC50 (Halogen Free);
3. Impedance Control;
4. 0.25mm Vias: Resin plugged and electroplated filled, compliant with IPC-4761 VII;
5. Blind Vias(L1-L2, L11-L12): Resin plugged and electroplated filled, compliant with IPC-4761 VII;
6. Ionic contamination: < 0.8 µg/cm² NaCL.

Layer: 12L
Base Material: FR4 TG170℃
Board Thickness: 1.8mm
Outer Layer Final Copper Thickness: 38.4UM
Inner Layer Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 220.00*170.00
Min. W/S(mil): 3.94/4.13
Min. Hole Size: 0.25mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s kind of PCB can you produce?
Our production is producing rigid PCB from 2~56layer with small- medium- mass volume. In the meantime, we can offer you FPC, Rigid-flex, HDI, all other special PCBs from our partner production.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com