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HDI laser blind buried via board

Product Image
HDI laser blind buried via board
Product Details
Layer: 8L
Base Material: FR4 TG150
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG+OSP+Impedance Control
Unit Size(mm): 65.0*50.0
Panel Size(mm): 140.0*150.0
Min W/S(mil): 3/3
Min Hole Size: 0.1mm
Solder Mask: Black
4 groups of single wire impedance and 4 groups of differential impedance
This board is a 2nd order HDI laser blind buried via board
BGA area surface treatment is OSP
Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ
  • What kind of board can you offer? How about the layer count and base material?
  • HoYoGo can offer board of HDI, gold finger, hard gold, flexible, flex-rigid, metal base, quick-turn around and PCBA. The layer is normally from 1 to 28layer. The base material also depends on the requirement, it can be KB or shengyi, etc.

Contact us

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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