HYG023F01014A

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Product Details

Special Request: PI Stiffener+FR4(0.9mm thickness) Stiffener

Layer: 1L

Base Material: PI

Board Thickness: 0.11mm

Final Copper Thickness: 1OZ

Surface Finished: ENIG

Unit Size(mm): 18.10*26.75

Min W/S(mil): 7.9/7.9

Solder Mask: Black Solder Mask+Yellow Coverlay

Production Process

ISO Certification

FAQ

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.