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HYG0883R02003A

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HYG0883R02003A
Product Details
Special Request: Plated Through Hole Copper Wall Thickness: Single Point min. 20um, Average: 25um
Layer: 2L
Base Material: FR4
Board Thickness: 1.575mm
Surface Finished: Immersion Silver
Unit Size(mm): 127.00*101.60

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UL Certification

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FAQ
  • What’s your most advantage of your supply?
  • @Standard mass production (>50sqm) from 1~8layer can be with very good price.
    @ Mass production (>50sqm) of CEM-1, Alu material can be with very good price.
    @ Special: we can produce long board up to 550x1500mm, thin board of min 0.15mm.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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