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HYG0883R02004A

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HYG0883R02004A
Product Details
Special Request: 
1. Plated Through Hole Copper Wall Thickness: Single Point min. 20um, Average: 25um
2. Solder Mask Thickness: min 10um
3. Outer Layer Final Copper Thickness: min.52.9um

Layer: 2L
Base Material: FR4
Board Thickness: 1.6mm
Surface Finished: Immersion Silver
Unit Size(mm): 43.18*31.75
Min W/S(mil): 25/25

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  • Can you update a WIP to us every day?
  • Yes, no problem. We can update it to you every day or every couple of days depends on customer request.

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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