HYG088R04124A

Product Image

Product Details

Layer: 4L
Base Material: FR4, IT-158
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: Immersion Tin
Unit Size(mm): 200.25*133.25
Min. W/S(mil): 6.3/6.3
Min. Hole Size: 0.35mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s your main material type?
KB, SY, NY, ITEQ, TUC, Ventec, etc.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com