Special Request: Holes with 0.1mm(10pcs) under the BGA must be made as Type VII filled & capped Via.
Base Material: FR4 TG130
Board Thickness: 1.0mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 9.80*9.80
Min W/S(mil): 6/6
Min Hole Size: 0.1mm
Who will be our parters
What kind of board can you offer? How about the layer count and base material?
HoYoGo can offer board of HDI, gold finger, hard gold, flexible, rigid-flex, metal base, quick-turn around and PCBA. The layer is normally from 1 to 28layer. The base material also depends on the requirement, it can be KB or shengyi, etc.
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : email@example.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.