HYG089R04340A
Product Image
Product Details
Special Request: Φ0.2mm/Φ0.3mm via hole opening solder masker on both
Layer: 4L
Base Material: FR4 TG130
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: HASL Lead Free
Unit Size(mm): 86.40*157.70
Min W/S(mil): 4.7/4.0
Min Hole Size: 0.2mm
Production Process
ISO Certification
UL Certification
Application areas
Who will be our parters
FAQ
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What’s your most advantage of your supply?
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@Standard mass production (>50sqm) from 1~8layer can be with very good price.
@ Mass production (>50sqm) of CEM-1, Alu material can be with very good price.
@ Special: we can produce long board up to 550x1500mm, thin board of min 0.15mm.
Contact us
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.