HYG089R04371A

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Product Details

1-step HDI Blind & Buried Via PCB
Special Request:
1. Buried vias between L2 and L3;
2. HDI blind vias between L1–L2 and L4–L3, resin-filled and copper-capped;
3. Impedance control required.

Layer: 4L
Base Material: FR4, IT150GTC, PP IT-150GBS
Board Thickness: 0.5+/-0.1mm
Outer Layer Final Copper Thickness: 30UM
Inner Layer Final Copper Thickness: 25UM
Surface Finished: ENIG
Unit Size(mm): 28.64*30.40
Min. W/S(mil): 3.93/3.93
Min. Hole Size: 0.1mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s your quality standard? What’s certificates do you have?
Our production is strictly following high quality system of automotive products, we certified with ISO9001, ISO14001, ISO13485 and IATF16949 and C-UL-S. All products strictly follow acceptance standard IPC-A-600-H and IPC-6012.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com