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Products

HYG089R06318A

Product Image
HYG089R06318A
Product Details
Special Request: 
1. Gold finger plating hard gold+Beveling
2. Beveling Depth: 0.5+/-0.2mm
3. Beveling Angle:45+/-5°

Layer: 6L
Base Material: FR4 TG170
Board Thickness: 1.6mm
Final Copper Thickness: 2OZ
Surface Finished: ENIG
Unit Size(mm): 305.94*205.80
Min Hole Size: 0.3mm
Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ
  • Can you produce board of gold finger?
  • Yes. HoYoGo can offer you gold finger, Au thickness can be suggested standard 30u” or per customer request.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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