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Products

HYG089R10351A

Product Image
HYG089R10351A
Product Details
Special Request: 
1. The inner layer has 2 kinds of copper thickness.
2. Solder Mask Thickness: 
    Solder Mask Thickness on Copper Edge: Min. 5um, 
    Solder Mask Thickness on Copper Surface: Min. 10um. 
3. BGA

Layer: 10L

Base Material: FR4 TG150
Board Thickness: 1.62mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 68.00*57.00
Min W/S(mil): 2.95/2.95
Min Hole Size: 0.2mm
Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ
  • What’s your quality standard? What’s certificates do you have?
  • Our production is strictly following high quality system of automotive products, we certified with ISO9001, ISO14001, ISO13485 and TS16949 and C-UL-S. All products strictly follow acceptance standard IPC-A-600-H and IPC-6012.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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