HYG1005R02011A

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Product Details

Special Request:
The specified 0.15 mm via need to be resin plugged and electroplated filled,
in compliance with IPC-4761 Type VII.

Layer: 2L
Base Material: FR4
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): Diameter 110 * Diameter 110
Min. W/S(mil): 7.87/6.75
Min. Hole Size: 0.15mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s kind of PCB can you produce?
Our production is producing rigid PCB from 2~56layer with small- medium- mass volume. In the meantime, we can offer you FPC, Rigid-flex, HDI, all other special PCBs from our partner production.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com