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Products

HYG1021R06003B

Product Image
HYG1021R06003B
Product Details
Special Request:Vias Plugged with Resin+Electroplate Flattened;
Layer: 6L
Base Material: FR4
Board Thickness: 0.75mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 32.0*21.5
Panel Size(mm): 66.0*46.0
Min W/S(mil): 4.92/4.9
Min Hole Size: 0.2mm
Solder Mask Alignment Tolerance +/-0.05mm
Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ
  • Can you offer FOB HK?
  • We have truck to HONGKONG every day. It will request MOV per shipment due to the local charge. Or we can shift with FOB and FCA according to order value.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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