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HYG1027R02001A

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HYG1027R02001A

Product Details

Special Request:
Gold Finger:
Alu: Min. 0.8um,
Ni: Min. 2.5um,
Beveling: 0.5+/-0.15mm.

Layer: 2L
Base Material: FR4 TG170
Board Thickness: 1.6mm
Final Copper Thickness: 2OZ
Surface Finished: ENIG
Unit Size(mm): 41.70*36.50
Min. Hole Size: 0.254mm

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FAQ

Can you provide some special material, like Rogers DuPont?
Yes. We can offer Rogers material, the specific type shall to be confirmed.
We can also offer Dupont material, we cooperate with Agent China.

Contact us

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.

(+86)-755-2300-1582

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