Layer: 2L
PI Stiffener: 5.0±0.5mm
Base Material: FR4
Board Thickness: 0.33mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG+Gold Finger
Unit Size(mm): 154.45*18.0
Min W/S(mil): 10/10
Solder Mask: Yellow
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.