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Products

HYG1103R08001A

Product Image
HYG1103R08001A
Product Details
Layer: 8L
Base Material: FR4
Board Thickness: 1.0mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 29.0*67.6
Panel Size(mm): 169.0*100.0
Min W/S(mil): 3.94/4
Min Hole Size: 0.2mm
Solder Mask: Matt Blue
Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ
  • Can you update a WIP to us every day?
  • Yes, no problem. We can update it to you every day or every couple of days depends on customer request.

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Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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