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HYG1146A01006A

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HYG1146A01006A
Product Details
Layer: 1L 
Base Material: ALU 2KV/AC 
Dielectric Layer Thickness: 0.1mm±20% 
Board Thickness: 1.6mm 
Final Copper Thickness: 1OZ 
Surface Finished: OSP 
Unit Size(mm): 43.5*43.5 
Panel Size(mm): 236.3*282.0 
Solder Mask: White 

ISO Certification

UL Certification

Application areas

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FAQ
  • What’s your most advantage of your supply?
  • @Standard mass production (>50sqm) from 1~8layer can be with very good price.
    @ Mass production (>50sqm) of CEM-1, Alu material can be with very good price.
    @ Special: we can produce long board up to 550x1500mm, thin board of min 0.15mm.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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