1. Solder Mask Thickness: min 10um(Copper surface)
2. All layers meet the breakdown voltage 2000V 50Hz
3. Coil Board, W/S(mil): 3.7/6.3,
The space between the coil position and the finished product: min 5mil
Base Material: FR4 TG≥135 CTI≥175
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 91.98*102.36
Min Hole Size: 0.3mm
Who will be our parters
What’s your most advantage of your supply?
@Standard mass production (>50sqm) from 1~8layer can be with very good price.
@ Mass production (>50sqm) of CEM-1, Alu material can be with very good price.
@ Special: we can produce long board up to 550x1500mm, thin board of min 0.15mm.
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : email@example.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.