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HYG1281F02025A

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HYG1281F02025A

Product Details

Special Request:
1. Surface Finished: ENEPIG (Ni:120-240U", Pd: min 1.2U", Au: min 2U")
2. Top Layer: Yellow Solder Mask Ink;
Bottom Layer: Yellow Coverlay

Layer: 2L
Base Material: PI
Board Thickness: 0.15mm
Final Copper Thickness: min25um
Surface Finished: ENEPIG
Unit Size(mm): 12.10*18.10
Min W/S(mil): 4.9/4.2

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ISO Certification

UL Certification

Application areas

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FAQ

Is there UL certificate for your flexible board?
YES. We can offer UL certificate of FPC.

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.

(+86)-755-2300-1582

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