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Products

HYG1284R04007A

Product Image
HYG1284R04007A
Product Details
Special Request: Solder Mask Thickness: Line Angle: 5um(min), Line Surface: 8um(min)
Layer: 4L
Base Material: FR4
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 291.20*28.20
Min W/S(mil): 7.87/7.88
Min Hole Size: 0.25mm
Production Process

ISO Certification

UL Certification

Application areas

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FAQ
  • Can you update a WIP to us every day?
  • Yes, no problem. We can update it to you every day or every couple of days depends on customer request.

Contact us

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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