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Products

HYG1313R04002A

Product Image
HYG1313R04002A
Product Details
Layer: 4L
Base Material: FR4
Board Thickness: 1.64mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 152.4*142.24
Panel Size(mm): 304.8*284.48
Min W/S(mil): 6/5
Min Hole Size: 0.2mm
Solder Mask Thickness: 10um(min)

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UL Certification

Application areas

Who will be our parters

FAQ
  • Can you offer DAP … term?
  • DAP is the old DDU from intercoms 2000. So we will follow this as Delivery Duty Unpaid.

Contact us

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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