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Products

HYG1316R04001A

Product Image
HYG1316R04001A
Product Details
Layer: 4L
Base Material: FR4 TG170
Board Thickness: 0.8mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 22.0*18.0
Panel Size(mm): 138.0*98.0
Min W/S(mil): 4.7/5
Min Hole Size: 0.2mm
Special Request: Half Hole; BGA;
Vias Plugged with Resin; Electroplate Flattened

ISO Certification

UL Certification

Application areas

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FAQ
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  • KB, SY, NY, ITEQ, TUC, Ventec, etc.

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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