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Products

HYG1317F02004A

Product Image
HYG1317F02004A
Product Details
Layer: 2L
Base Material: PI
Board Thickness: 0.25mm
Surface Finished: ENIG
Unit Size(mm): 36.0*45.21
Min W/S(mil): 7.9/7.9
Min Hole Size: 0.2mm
FR4 Stiffener+PI Stiffener

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ
  • Can you produce board of gold finger?
  • Yes. HoYoGo can offer you gold finger, Au thickness can be suggested standard 30u” or per customer request.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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