HYG2694F02028A

Product Image

Product Details

Layer: 2L
Base Material: FPC+ALU Stiffener
Board Thickness: FPC: 0.24+/-0.05mm,
FPC+ALU Stiffener: 1.6mm+/-10%
Final Copper Thickness: 1OZ
Surface Finished: OSP
Unit Size(mm): 102.00*130.00
Min. W/S(mil): 7.9/7.9
Min. Hole Size: 0.3mm
Solder Mask: Green

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Are you a manufacturer (Factory) or trading company?
HoYoGo is a manufacturer with a mass production of 500000 sqm factory and a medium-size production for small-medium volume. Our UL No. is E493066.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com