HYG293R06208B

Product Image

Product Details

Surface Finished: ENIG+Gold Finger
Layer: 6L
Base Material: FR4
Board Thickness: 1.5mm
Final Copper Thickness: 1OZ
Unit Size(mm): 118.07*160.0
Panel Size(mm): 248.07*180.0
Min W/S(mil): 5.9/5.8
Min Hole Size: 0.2mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Can you produce board of gold finger?
Yes. HoYoGo can offer you gold finger, Au thickness can be suggested standard 30u” or per customer request.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com