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Products

HYG306F02018A

Product Image
HYG306F02018A
Product Details
Layer: 2L
Base Material: PI
Board Thickness: 0.118mm
Surface Finished: ENIG
Unit Size(mm): 2.0*18.7
Panel Size(mm): 35.0*58.0
Min W/S(mil): 3.94/3.94
Min Hole Size: 0.1mm
Solder Mask: Green+Yellow

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ
  • Is there UL certificate for your flexible board?
  • YES. We can offer UL certificate of FPC.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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