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Products

HYG306RF03035A

Product Image
HYG306RF03035A
Product Details
Rigid-Flex PCB
Layer: 3L
Base Material: FR4 TG150+PI
Board Thickness: 1.0mm
Surface Finished: ENIG
Unit Size(mm): 55.78*45.0
Panel Size(mm): 114.0*70.0
Solder Mask: Green+Yellow
Min W/S(mil): 3.94/4.9
Min Hole Size: 0.1mm
Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ
  • What kind of board can you offer? How about the layer count and base material?
  • HoYoGo can offer board of HDI, gold finger, hard gold, flexible, flex-rigid, metal base, quick-turn around and PCBA. The layer is normally from 1 to 28layer. The base material also depends on the requirement, it can be KB or shengyi, etc.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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