HYG308R02028A

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Product Details

Layer: 2L
Base Material: FR4 TG130
Board Thickness: 1.0mm
Final Copper Thickness: 2OZ
Surface Finished: ENIG
Unit Size(mm): 67.4*33.2
Panel Size(mm): 165.0*310.0

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com