HYG502R04025A

Product Image

Product Details

Special Request:
1. Solder Mask Ink Model: H-9100 8G,
Solder Mask Thickness≥10um.
2. ENIG(Gold Thickness≥2u", Ni Thickness≥118u").

Layer: 4L
Base Material: FR4 TG150, CTI≥175, KB6165
Board Thickness: 1.0mm
Outer Layer Final Copper Thickness: 52.9UM
Inner Layer Final Copper Thickness: 2OZ
Surface Finished: ENIG
Unit Size(mm): 42.00*91.70
Min. W/S(mil): 7.9/7.9
Min. Hole Size: 0.2mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Do you have a price list?
PCB is customized product; all prices will depend on customer actual gerber data and qty request, it will be difficult to provide it.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com