HYG503R04001A
			Product Image
			
			
			Product Details
Special Request: 
There are special stack up structure requirements.
Layer: 4L
Base Material: FR4 TG135 
Board Thickness: 1.57mm
Final Copper Thickness: 1OZ 
Surface Finished: ENIG
Unit Size(mm): 192.00*57.00
Min. W/S(mil): 7.9/7.9
Min. Hole Size: 0.3mm
Production Process
			
	ISO Certification
	 
 
	UL Certification
	 
 
	Application areas
	 
 
	Who will be our parters
	 
			FAQ
	- 
		Can you update a WIP to us every day?
	
- 
		Yes, no problem. We can update it to you every day or every couple of days depends on customer request.
	
	Contact us
	Welcome to the HOYOGO website! 
	HONGKONG HOYOGO TECHNOLOGY CO.,LTD 
	SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD 
	Tel : (+86)-755-2300 1582
	Fax : (+86)-755-2720 6126
	Email : sales@hygpcb.com
	Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.
	
