HYG522R06001A

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Product Details

Special Request:
1. CAF resistance tested in accordance with IPC-TM-650.
2. Ionic contamination: <0.6 μg NaCl/cm²; free of PBB and PBDE.
3. Critical dimensions controlled to Cpk≥1.33, per drawing requirements.
4. Press-fit holes.
5. Board warpage ≤ 0.5%.
6. Continuous operating temperature: 120°C. Continuous operating voltage: 950V.

Layer: 6L
Base Material: FR4 TG175℃, CTI>175(S1000-2M)
Board Thickness: 1.6mm
Outer Layer Final Copper Thickness: >33.4um
Inner Layer Final Copper Thickness：>24.9um
Surface Finished: Immersion Tin
Unit Size(mm): 231.00*280.00
Min. W/S(mil): 5.9/5
Min. Hole Size: 0.2mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s your most advantage of your supply?
@Standard mass production (>50sqm) from 1~50 Layer can be with very good price.
@ Mass production (>50sqm) of CEM-1, Alu material can be with very good price.
@ Special: we can produce long board up to 550x1500mm, thin board of min 0.15mm.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com