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HYG609F02003A

Product Image

HYG609F02003A

Product Details

Application Field: Medical Device
Layer: 2L
Base Material: FPC+PI Stiffener+FR4 Stiffener & Adhesive Tape
Board Thickness:
FPC: 0.23+/-0.03mm
FPC+PI Stiffener: 0.3±0.03mm
FPC+FR4 Stiffener+Adhesive Tape: 0.47±0.05mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 36.40*111.00
Min. W/S(mil): 5.9/6.83
Min. Hole Size: 0.3mm
Solder Mask: Green

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Is there UL certificate for your flexible board?
YES. We can offer UL certificate of FPC.

Contact us

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.

(+86)-755-2300-1582

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