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Products

HYG718R02054A

Product Image
HYG718R02054A
Product Details
Special Request: 
1. BGA
2. Solder Mask Ink Model: H-9100 44G
3. Impedance Control Board
4. Board Bending: Max. 5%

Layer: 2L
Base Material: FR4 TG135 KB6160
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: OSP
Unit Size(mm): 160.00*170.00
Min. W/S(mil): 4/4
Min. Hole Size: 0.3mm
Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ
  • Do you have quick-turn service for prototype?
  • Yes. HoYoGo offers quick-turn service for prototype. Delivery time: 3~7wds according to PCB layer count and layout.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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