HYG753A01008A

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Product Details

Special Request:
1. Base Material Model: BOYU AL-01-B 30, Solder Mask Model: TAIYO LEW3;
2. There are 15 M2.5 internal threaded holes in the unit, and the assembly direction
is from Top to BOTTOM (copper surface to aluminum base);
3. Dielectric Thickness: 0.10mm+/-20%.

Layer: 1L
Base Material: ALU 3 W/m·k
Board Thickness: 3.20mm
Final Copper Thickness: 1OZ
Surface Finished: HASL Lead Free
Unit Size(mm): 209.80*35.80
Solder Mask: White

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s your most advantage of your supply?
@Standard mass production (>50sqm) from 1~8layer can be with very good price.
@ Mass production (>50sqm) of CEM-1, Alu material can be with very good price.
@ Special: we can produce long board up to 550x1500mm, thin board of min 0.15mm.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com